Argonne National Laboratory

Nanofabrication and Devices Capabilities

The CNM’s ability to fabricate complex nanostructures and devices is based on the advanced tool set housed within the Nanofabrication & Devices Group’s clean room. The bay-and-chase configured clean room spans over 11,500 sq. ft. and contains a remarkable depth and breadth of nanofabrication equipment. The clean room staff have over 100 combined years of experience in fabrication, processing, and MEMS design, development, and manufacturing. See below for the full equipment list.

The CNM lithography suite is housed in three bays and includes several advanced lithography tools covering electron beam lithography, ion beam lithography, direct write optical lithography, contact printing with back-side alignment, nanoimprint lithography, and holographic lithography. A deposition suite, also housed in three bays, can produce a variety of dielectric and metal films using multi-chamber sputtering tools, electron beam evaporation, and plasma enhanced chemical vapor deposition (PECVD). A unique set of carbon-based materials synthesis tools includes microwave plasma CVD for diamond films and an Atomate CNT-CVD System for producing CNT and graphene materials.

A wet etch bay includes electroplating, an electrochemical workstation and supercritical drying capability for post processing. The main tools in the dry etch bay are a dual chamber Oxford Instruments Plasmalab 100 and two tabletop March Plasma RIE tools. There are additional metrology tools for measurements of film thickness, critical dimensions, and stress including profilometers, a spectroscopic ellipsometer, and AFM. Finally, a biohazard level 2 biobay enables the functionalization of surfaces with biomolecules without breaking device cleanliness protocol.

Lithography

  • Electron Beam Lithography System: JEOL 9300
  • Electron Beam Lithography System: Raith 150
  • Focused Ion Beam: FEI Nova 600 NanoLab
  • Interferometric Lithography System
  • Laser Pattern Generator: Microtech LW405
  • Nanoimprint Nanonex NX3000
  • SUSS MA6/BA6: Contact aligner for front side and front-to-back side alignment
  • Wafer priming oven: YES-TA series
  • Stepper: ASML PAS 5000 wafer stepper and scanner (resolution to 500 nm; users need to supply their own 5x5 mask with standard stepper marks)

Deposition

  • AJA Oxide Sputtering, 3-inch targets
  • AJA Oxide Sputtering, 2-inch targets
  • Atomic Layer Deposition (Sundew D200)
  • Lambda Microwave Plasma CVD System: nanocrystalline diamond deposition
  • Oxford Plasmalab 100 Inductively Coupled Plasma Enhanced Chemical Vapor Deposition
  • Sputter deposition system (Emitech K675X)
  • Temescal FC2000 Electron Beam Evaporator (materials requested require process custodian approval)
  • Thermal/PECVD System for CNT and Graphene Synthesis

Dry Etching

  • RIE Oxford PlasmaLab 100, Chlorine Chamber
  • RIE Oxford PlasmaLab 100, Fluorine Chamber
  • RIE March CS-1701, Chlorine Chamber
  • RIE March CS-1701, Fluorine Chamber
  • Hydrofluoric acid vapor etcher
  • Xactix X4 xenon difluoride etcher

Wet Chemistry

  • Electroplating (Au, Cu, Fe, Ni, Pt)
  • Selective wet chemical etching
  • Wafer Spin Rinse Dryer: VERTEQ

Inspection and Metrology

  • Atomic Force Microscope: Park Scientific XE-HDD
  • Filmetrics f40 thin film analyzer
  • Four point probe
  • Optical Microscope: Olympus MX-61
  • Potentiostat
  • Scanning Probe Microscope (PSIA Park Scientific XE-HDD)
  • Scanning Vibrating Electrode: SVET M370
  • Three-Dimensional Contact Profilometer: Dektak 8
  • UVISEL Spectroscopic Ellipsometer: Horiba Jobin Yvon
  • Scanning Electron Microscope VEGA 3 (tungsten filament)

Post-Processing

  • Critical Point Dryer (Leica CPD030)
  • Thermocarbon Dicing Saw: TCAR 864-1

Theory

  • Would you like Theory with that? Joint experimental-theory proposals are possible and encouraged; visit the Theory & Modeling Group's website for more information about their capabilities.