Argonne National Laboratory

Sequential Infiltration Synthesis for Enhancing Advanced Lithography

Technology available for licensing: The invention is a plasma etch resist material modified by an inorganic protective component via sequential infiltration synthesis (SIS) and methods of preparing the modified resist material. The SIS process forms the protective component within the bulk resist material through a plurality of alternating exposures to gas phase precursors which infiltrate the resist material.


  • The plasma etch resist material may be initially patterned using photolithography, electron-beam lithography or a block copolymer self-assembly process.
  • The modified resist material is characterized by an improved resistance to a plasma etching or related process relative to the unmodified resist material, and
  • Thereby allowing formation of patterned features into a substrate material, which may be high-aspect ratio features.

IN-10-106 & IN-10-106b

US Patent # 8,980,418

US Patent Application filed