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Center for Nanoscale Materials

Nanofabrication and Devices Capabilities

The CNM’s ability to fabricate complex nanostructures and devices is based on the advanced tool set housed within the Nanofabrication & Devices group’s clean room.

The CNM’s ability to fabricate complex nanostructures and devices is based on the advanced tool set housed within the Nanofabrication & Devices group​’s clean room. The bay-and-chase configured cleanroom spans over 11,500 square feet and contains a remarkable depth and breadth of nanofabrication equipment. The clean room staff have over 100 combined years of experience in fabrication, processing and MEMS design, development and manufacturing. See below for the full equipment list.

The CNM lithography suite is housed in three bays and includes several advanced lithography tools covering electron beam lithography, ion beam lithography, direct write optical lithography, contact printing with back-side alignment, nanoimprint lithography and holographic lithography. A deposition suite, also housed in three bays, can produce a variety of dielectric and metal films using multi-chamber sputtering tools, electron beam evaporation, and plasma enhanced chemical vapor deposition (PECVD). A unique set of carbon-based materials synthesis tools includes microwave plasma CVD for diamond films and an Atomate CNT-CVD System for producing CNT and graphene materials.

A wet etch bay includes electroplating, an electrochemical workstation and supercritical drying capability for post processing. The main tools in the dry etch bay are a dual chamber Oxford Instruments Plasmalab 100 and two tabletop March Plasma RIE tools. There are additional metrology tools for measurements of film thickness, critical dimensions, and stress including profilometers, a spectroscopic ellipsometer, and AFM. Finally, a biohazard level 2 biobay enables the functionalization of surfaces with biomolecules without breaking device cleanliness protocol.


  • Electron Beam Lithography System: JEOL8100FS
  • Electron Beam Lithography System: Raith 150
  • Focused Ion Beam: FEI Nova 600NanoLab
  • Interferometric Lithography System
  • Heidelberg MLA150 Maskless Lithography
  • Laser Pattern Generator: Microtech LW405
  • Nanoimprint Nanonex NX3000
  • SUSSMA6/BA6: Contact aligner for front side and front-to-back side alignment
  • Wafer priming oven: YES-TA series
  • Stepper: ASMLPAS5000wafer stepper and scanner (resolution to 500nm; users need to supply their own 5x5mask with standard stepper marks)

Ultralow Temperature/Strong Magnetic Field Measurements

  • BlueFors LD400 Dilution Refrigerator System: <10 mK base temperature, 5x free-space optical access points, 100x dc wires, 20x microwave cables, 2x high-pressure fill lines, expedited sample loading mechanism, low-noise amplifiers for qubit research
  • AMI Superconductor Vector Magnet: 5T in z-axis, 1T in y-axis, 1T in x-axis, 10 mG field stability, 3-axis persistent switches


  • AJA Oxide Sputtering, 3-inch targets
  • AJA Oxide Sputtering, 2-inch targets
  • AJA Dielectric Sputtering
  • AJA Metal Sputtering
  • Atomic Layer Deposition (Arradiance Gemstar)
  • Lambda Microwave Plasma CVD System: nanocrystalline diamond deposition
  • Oxford Plasmalab 100 Inductively Coupled Plasma Enhanced Chemical Vapor Deposition
  • Temescal FC2000 Electron Beam Evaporator (materials requested require process custodian approval)

Dry Etching

  • RIE Oxford PlasmaLab 100, Chlorine Chamber
  • RIE Oxford PlasmaLab 100, Fluorine Chamber
  • RIE March CS-1701, Chlorine Chamber
  • RIE March CS-1701, Fluorine Chamber
  • RIE Oxford ICP Etcher (6-inch)
  • Hydrofluoric acid vapor etcher
  • Xactix X4 xenon difluoride etcher

Wet Chemistry

  • Electroplating (Au, Cu, Fe, Ni, Pt)
  • Selective wet chemical etching
  • Wafer Spin Rinse Dryer: VERTEQ

Inspection and Metrology

  • Bruker FastScan Atomic Force Microscope
  • Filmetrics f40 thin film analyzer
  • Four point probe
  • Laser Confocal Microscope OLS4100
  • Optical Microscope: Olympus MX-61
  • Potentiostat
  • Scanning Probe Microscope (PSIA Park Scientific XE-HDD)
  • Scanning Vibrating Electrode: SVET M370
  • Three-Dimensional Contact Profilometer: Dektak 8
  • UVISEL Spectroscopic Ellipsometer: Horiba Jobin Yvon
  • Scanning Electron Microscope VEGA 3 (tungsten filament)


  • AS-One 150 Rapid Thermal Processor
  • Cleaving Machine: LatticeGear LatticeAx 420
  • Critical Point Dryer (Leica CPD030)
  • ADT Dicing Saw

Piezo-Optomechanical Spectrometer (POMS)

Wear/Friction Measurements

  • Multifunctional Tribometer with controlled environments
  • Sonotek Ultrasonic Spray Coating System


  • Would you like Theory with that? Joint experimental-theory proposals are possible and encouraged; visit the Theory & Modeling group’s webpage for more information about their capabilities.