- Post-Processing
- ADT Dicing Saw
- AS-One 150 Rapid Thermal Processor
- Critical Point Dryer (Leica CPD300)
- e3511 Plasma Asher
- Hybond 626 Wire bonder
- LatticeGear Cleaving Machine
- SET FC-150 Flip-chip bonder
- Deposition
- AJA Dielectric Sputtering System
- AJA Metal Sputtering System
- AJA Oxide Sputtering, 3 inch targets
- AJA Sputtering, 2 inch targets
- Angstrom Sputtering System
- Angstrom Engineering Thermal Evaporator
- AMAT P5000 Deposition Tool (SiNx, SiO2, TEOS Films)
- Atomic Layer Deposition (Arradiance Gemstar)
- Cressington sputter coater 108auto
- Integrated UV-Ozone Cleaner and Molecular Vapor Coater (Nanonex Ultra-100)
- Oxford Plasmalab 100 Inductively Coupled Plasma Enhanced Chemical Vapor Deposition
- Lambda Microwave Plasma CVD System: nanocrystalline diamond deposition
- Temescal FC2000 Electron Beam Evaporator
- Ultralow Temperature/Strong Magnetic Field Measurements
- BlueFors LD400 Dilution Refrigerator System
- AMI Superconductor Vector Magnet
- Inspection and Metrology
- Bruker FastScan Atomic Force Microscopy (AFM)
- Filmetrics f40 Thin Film Analizer
- Four Point Probe
- K-Space Stress Gauge
- Keyence 3D Laser Scanning Confocal Microscope, VK-X1000
- Laser Confocal Microscope OLS4100
- Optical Microscope: Olympus MX-61
- Potentiostat
- Scanning Vibrating Electrode: SVET M370
- Surface Profiler
- UVISEL Spectroscopic Ellipsometer: Horiba Jobin Yvon
- Scanning Electron Microscope VEGA 3 (tungsten filament)
- Lithography
- Electron Beam Lithography System: JEOL 8100FS
- Heidelberg MLA 150 Maskless Lithography
- Electron Beam Lithography System: Raith 150
- Focused Ion Beam: FEI Nova 600 NanoLab
- Interferometric Lithography System
- Laser Pattern Generator (Microtech LW405, direct write optical lithography)
- SUSS MA6/BA6: Contact aligner for front side and front-to-back side alignment
- Wafer priming oven: YES-TA series
- Stepper: ASML PAS 5000 wafer stepper
- Wet Chemistry
- Electroplating (Au, Cu, Fe, Ni, Pt)
- Selective Wet Chemical Etching
- Dry Etching
- Hydrofluoric acid vapor etcher
- ONTOS Atmospheric Plasma Surface Treatment System
- Oxford PlasmaPro 100 Cobra, RIE-ICP and ALE
- PlasmaTherm Deep Reactive Ion Etcher (DRIE) for silicon
- RIE Oxford ICP etcher (6-inch)
- RIE March CS-1701, Fluorine Chamber
- RIE Oxford PlasmaLab 100, Chlorine Chamber
- RIE Oxford PlasmaLab 100, Fluorine Chamber
- SPTS uEtch HF Vapor Release tool
- Xactix X4 xenon difluoride etcher
- Wear/Friction Measurements
- Multifunctional Tribometer (controlled environment)
- TEM Picoindenter, in situ (PI-95)
- Sonotek Ultrasonic Spray Coating System
- POMS: Piezo-optomechanical Spectrometer
- Adiabatic Demagnetization Refrigerator (ADR)
- Computational Nanoscience Software and Modeling Expertise
- BLAST (Bridging Length/Timescales via Atomistic Simulation Toolkit)
- Dacapo
- Density-functional-based tight-binding (DFTB)
- FANTASTX (AI/ML Framework framework to determine atomistic-level structures from multi-modal experimental and theoretical data)
- GPaw, a real space, grid-based DFT-PAW code
- Ingrained
- MPI-based parallel versions of the nanophotonics
- Time-domain nanophotonics simulation package
- VASP, ab-initio molecular dynamics calculations
- Other specialized analysis software or modeling expertise
- CNM High Performance Computing Cluster (Carbon)
- Centrifuge
- Beckman Coulter Avanti J-E Centrifuge
- Beckman Coulter Optima L-100 XP Ultracentrifuge
- Surface Preparation
- Harrick Plasma Cleaner
- UVO Surface Cleaner
- Visible and near-IR microscopy
- Lamp illumination
- Laser illumination
- Visible detection
- NEAR-IR detection
- Cryostat
- Synthesis
- Surface modification of nanoparticles
- Functionalization
- Quantum Dots
- Metal nanoparticles
- Metal oxide nanoparticles
- Raman spectroscopy
- Temperature-controlled stage
- Time-resolved emission spectroscopy (streak camera)
- Time-correlated single photon counting (TCSPC) spectroscopy (Photon-correlation microscope))
- TCSPC Microscopy (400-800 nm)
- Visible and near-IR TCSPC with streak camera
- Near-IR TCSPC with superconducting nanowire single photon detector
- Bench-top spectroscopy
- UV-Visible Absorption
- Emission (spectrofluorimeter)
- FTIR Absorption
- Circular Dichroism
- Transient absorption spectroscopy
- Visible probe
- Near-IR probe
- THz probe
- Cryostat
- Correlation/antibunching measurements
- Visible (350-800 nm) detection with APD detectors
- NIR (800 nm - 2 μm) detection with Superconducting nanowire single-photon detectors (SNSPD)
- enVISion Transient Absorption Spectrometer
- FLS1000 spectrofluorimeter
- Isothermal Titration Calorimeter (ITC)
- MEOS: Magneto-Electro-Optical Spectrometer
- Electron Paramagnetic Resonance EPR EleXsys 500-E (CW)
- Pulsed Electron Paramagnetic Resonance EPR EleXsys-II 580
- Electrochemical Workstation (BASi Epsilon)
- GC-MS (Agilent 5975C Series GC/MSD)
- HPLC (Agilent 1260 LC System)
- ZetaSizer Nano, Malvern (particle size potential)
- Magneto-optical Microscope
- Drop Shape Analysis Tool
- Solar simulator, Oriel
- Field Emission Scanning Electron Microscope, JEOL JSM-7500F
- Laser Scanning Confocal Microscope, Zeiss LSM 510 Meta
- Optical microscope, Zeiss Axio Imager Z1 M Upright
- Automated Thin Film Solution Processing Robot
- Ossila Slot-Die Coater
- Thin film transfer system
- General wet lab space for sample prep
- Autoclave
- Rotary Evaporator
- Schlenk Lines
- Solution-Shearing Station
- Integrated Glove Box System
- Peptide Synthesizer
- Agilent Inductively Coupled Plasma Optical Emission spectroscopy (ICP-OES, Bldg 200)
- Electrical characterization
- associated high-sensitivity test systems
- Keithley 4200-SCS/F Semiconductor Parameter Analyzer
- X-Ray diffractometer (Bruker D8 Discover, point detector, VANTEC-1 linear detector)
- Bragg-Brentano powder
- Grazing incidence
- High resolution four-circle
- Reciprocal space mapping
- Reflectivity
- Rocking curves
- VT-UHV-atomic force microscope/scanning tunneling microscope (AFM/STM; Omicron VT-AFM XA) (NST-SOP-086.6)
- Contact AFM
- Magnetic force microscopy
- Non-contact AFM
- Scanning tunneling spectroscopy
- Thermal analysis
- Differential scanning calorimetry, Mettler Toledo 823
- Thermogravimetric analysis, Mettler Toledo 851
- Physical vapor deposition, common loadlock is shared
- Lesker e-beam evaporator (PVD250)
- Lesker sputtering system (CMS18)
- Scanning probe microscope, Veeco MultiMode 8 (NST-SOP-006.9)
- PeakForce quantitative nanomechanical mapping
- PeakForce tapping
- Fluid imaging
- Low current scanning tunneling microscopy
- Magnetic Force
- Variable temperature imaging (-30 to 250 C)
- Magnetometry
- Quantum Design MPMS-XL
- Quantum Design PPMS-9
- Asylum Cypher-S AFM (NST SOP 290)
- X-ray diffractometer (Bruker D8 XRD with Eiger2 detector)
- Bruker Vertex 70 FTIR with Hyperion Microscope (Building 200)
- Cary 5000 UV-Vis-NIR (Building 200)
- Langmuir-Blodgett, Kibron MicroTrough X (Building 200)
- Rheometer, AntonPaar Physica MCR301
- Rheo-XPCS
- Spin Coater, Laurell WS-400, not for lithography resist work
- Synchrotron X-ray Scanning Tunneling Microscopy (B125)
- Synthesis Lab - inorganic crystals
- Optical UHV VT STM/AFM (NST-SOP-126.9)
- Lasers for Optical UHV VT STM/AFM
- Tube furnaces (1 in.)
- UV-Vis-NIR spectrometer, Perkin-Elmer Lambda 950
- Low temperature multimode scanning tunneling microscopy (LT-STM, Createc) (NST-SOP-196.2)
- Omicron LT-STM (SOP 303)
- UHV Cryo SFM with 6T magnetic field, Omicron scanning tunneling microscope (NST-SOP-205)
- SPM Tip Etching
- West-Bond Wire Bonder
- X-ray diffractometer (Bruker D2 Phaser XRD)
- X-ray diffractometer (Bruker D8 Discover, Eiger 2 R 500K detector)
- ACAT: Argonne Chromatic Aberration-corrected TEM
- Cc/Cs - corrected HRTEM imaging and diffraction
- Cc/Cs - corrected EFTEM imaging and diffraction
- Hard X-ray Nanoprobe
- Chemical and Structural Nanoimaging
- Scanning Nanodiffraction
- Specimen preparation resources (not FIB)
- Cutting from bulk
- Grinding/polishing
- Dimpling
- Ion-milling
- Vacuum-coating with gold or carbon
- Data Analysis
- Image processing
- HRTEM image simulation
- Diffraction pattern simulation
- XEDS analysis (including spectrum images)
- EELS analysis (including spectrum images or EFTEM spectrum images)
- Hitachi S-4700-II SEM
- SEI & BSE imaging (0.5-30 kV)
- XEDS mapping or spectrum imaging
- Field Emission Transmission Electron Microscope, JEOL JEM-2100F
- TEM imaging and diffraction (200 kV)
- EFTEM imaging (200 kV)
- EELS (200 kV)
- XEDS
- Tomography (200 kV)
- Special specimen holders
- Talos F200X (S)TEM
- TEM imaging and diffraction (80, 120, & 200kV)
- STEM imaging (HAADF & BF; DF2, DF4, DPC, 80, 120, & 200 kV)
- XEDS, Super-X, 4SDD EDX system
- EDS mapping (profiles and/or maps)
- Lorentz imaging (200 kV)
- Tomography (200 kV)
- Zeiss 1540XB FIB-SEM
- TEM sample preparation
- 3D FIB-SEM serial sectioning
- SEI & BSE imaging (in conjunction with FIB cross-sectioning)
- Ultrafast Electron Microscopy (UEM)
- Temporal resolution
- Pump
- Holders
- FEI Quanta 400F (E)SEM
- High-vacuum mode (P < 10-5 torr)
- Low-vacuum mode (P ~ 0.1-2 torr)
- ESEM mode (P ~ 2-20 torr)
- ESEM mode with a gas other than air or water vapor
- Peltier-cooled stage (T ~ 248-328 K)
- Heating stages (T < 1273 K or T < 1773 K)
- JEOL IT800HL SEM
- TFS Spectra 200
