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Interfacial Science

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  • The promise of deep grooves

    A manufacturing technique that could help the semiconductor industry make more powerful computer chips began in the humblest of places — at a lunch table at the U.S. Department of Energy’s (DOE) Argonne National Laboratory.
    Silicon wafers, ranging in size from 4” to 12” diameter, which have been treated using Argonne’s sequential infiltration synthesis method.