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Henry Chan

Materials/Ceramics/Metallurgical 2

Biography

Ph.D., University of Illinois at Chicago

Research Interests

  • Multi-scale modeling of materials, from the atomistic scale to the continuum scale
  • Soft materials, hierarchical self-assembly, nature inspired materials for a circular economy
  • Development of computationally efficient yet accurate methodologies for molecular simulations and inverse design problems
  • AI/ML based frameworks for materials discovery, imaging, and microstructure characterization
  • HPC workflows and data infrastructure for autonomous experimentation and remote operations

Highlights