Argonne National Laboratory
Microelectronics Events
Upcoming Events
Past Events
2025-2026
Microelectronics Colloquia Series
| Date | Title | Speaker |
|---|---|---|
| 1/30/2026 | “CMOS Scaling Towards Sub-2 nm Stacked CFETs” Abstract | Santosh Kurinec, Rochester Institute of Technology |
| 10/24/2025 | “Room-Temperature Ferromagnetism in Transition Metal Dichalcogenides” Abstract | Christopher Hinkle, University of Notre Dame |
| 10/9/2025 | “Charon: Toward an Adaptive Software Infrastructure for High Performance Data Streaming at the Edge” Abstract | Yongho Kim (MCS) |
| 10/3/2025 | “Semiconductor Interconnect Patterning: Innovations and Challenges” Abstract | Marie Krysak, Intel |
| 9/26/2025 | “Enabling Energy-Efficient Artificial Intelligence Hardware with Spintronics” Abstract | Cheng Wang, Iowa State University |
2024-2025
Microelectronics Colloquia Series
| Date | Title | Speaker |
|---|---|---|
| 5/2/2025 | “Microelectronics at the Intersection: Work, Heat and Information on the Road to 2050” Abstract | Nancy M. Haegel, A Center for Power Electronics Materials and Manufacturing Exploration (APEX), National Renewable Energy Laboratory |
| 3/7/2025 | “Photons with a Twist: Probing and Manipulating Atomic Distortions and Dipole Textures in Quasi-2D Ferroelectric” Abstract | Edwin Fohtung, Rensselaer Polytechnic Institute |
| 2/26/2025 | “What Are 2D Materials Good For?” Abstract | Prof. Eric Pop, SystemX Alliance and Stanford University |
| 2/7/2025 | “Strange Things Happen When Nanomaterials Are Driven Far From Equilibrium” Abstract | Jonathan Bird, University at Buffalo |
2023-2024
Microelectronics Colloquia Series
| Date | Title | Speaker |
|---|---|---|
| 10/11/2024 | “Oxides for microelectronics and brain-inspired platforms” Abstract | Prof. Giulia Galli, Liew Family Professor of Molecular Engineering & Professor of Chemistry, University of Chicago; Senior Scientist and Director of the Midwest Integrated Center for Computational Materials (MICCoM), Argonne National Laboratory |
| 8/23/2024 | “Reliability Assessment for Heterogeneously Integrated Packages” Abstract | Prof. Ganesh Subbarayan, James G. Dwyer Professor of Mechanical Engineering, Purdue University; Director, Atalla Institute for Advanced System Integration |
| 6/7/2024 | “Advancing Tight-Pitch Redistribution Layers for Heterogeneous Integration: An Equipment Supplier’s Perspective” Abstract | Dr. Roger Quon, Director of Technology, Applied Materials, NY |
| 4/5/2024 | “Ferroic Complex Oxides for Next-Generation Applications and Devices” Abstract | Prof. Lane W. Martin, Director of the Rice Advanced Materials Institute Welch Professor of Materials Science and NanoEngineering, Rice University, Houston, TX |
| 2/16/2024 | “Imaging Particles” Abstract | Dr. Daniel Durham, Argonne National Laboratory |
| 2/8/2024 | “New Direct Electron Imaging Techniques for Quantum Materials” Abstract | Prof. Kayla Nguyen, University of Oregon |
| 11/10/2023 | “Advancing CMOS technology innovation in Nanosheet technology era” Abstract | Dr. Kai Zhao, Senior Manager, Platform Technology Group Dr. Daniel Schmidt, Metrology Manager, Senior Engineer |
| 10/20/2023 | “Computing with electric-field-controlled and antiferromagnetic spintronic devices” Abstract | Prof. Pedram Khalili, Department of Electrical and Computer Engineering, Northwestern University, Evanston, IL |
| 10/6/2023 | “Heterostructures for Low-Power Logic and Memory Devices” Abstract | Prof. Deep Jariwala, Associate Professor/Peter & Susanne Armstrong Distinguished Scholar, Department of Electrical and Systems Engineering, University of Pennsylvania |
| 9/22/2023 | “Computing with analog dynamical memristors and memcapacitors” Abstract | Prof. J. Joshua Yang, Professor of Electrical and Computer Engineering, University of Southern California |
| 9/15/2023 | “2D and Magnetic Materials for Unconventional Computing” | Prof. Jean Anne Incorvia, Assistant Professor, Electrical and Computer Engineering, The University of Texas at Austin, Austin, TX |
| 7/14/2023 | “Exploring the Role of 2D Materials in Future Microelectronics” Abstract | Prof. Saptarshi Das, Assistant Professor, Materials Science and Engineering, Penn State University |
| 6/23/2023 | “Materials perspective on the EUV lithography: Challenges and Outlook” Abstract | Dr. Hyung Ju Ryu, Principal Engineer, Samsung Electronics Semiconductor R&D Center, South Korea |
| 6/1/2023 | “Pioneering Nanomaterials and Nanodevices through Direct Atomic Layer Processing for Advanced Applications” Abstract | Dr. Maksym Plakhotnyuk, CEO & Founder, ATLANT 3D Nanosystems, Denmark |
| 5/25/2023 | “Neuromorphic Computing for Machine Learning” Abstract | Dr. Wilfried Haensch, Consultant, Argonne National Laboratory |